Ultrafast Femtosecond Laser Cutting: Redefining Zero-Defect Glass Processing for Semiconductor Packaging
Gololaser
2026-04-16
Glass, a critical material for semiconductor packaging (e.g., TGV substrates with thicknesses 50–500μm), demands ultra-precision cutting to meet strict edge quality standards. Traditional mechanical cutting often causes chipping, microcracks, and residual stress, requiring time-consuming post-polishing and increasing production costs. Conventional long-pulse lasers, meanwhile, generate noticeable heat-affected zones (HAZ), degrading via accuracy and long-term reliability.
Our new infrared femtosecond laser cutting system delivers a paradigm shift. With femtosecond-level pulses (10⁻¹⁵s), it achieves "cold processing" by directly breaking glass molecular bonds without significant heat conduction. Equipped with an independently developed infrared laser source optimized for TGV glass optics, the system delivers nanometer-level energy focusing precision. Key performance metrics include:
Edge roughness Ra ≤ 0.1μm
Chipping width < 5μm
Zero HAZ, eliminating post-processing grinding
This technology enables direct, high-yield processing of ultra-thin glass for semiconductor packaging, supporting the upgrade of industrial clusters such as Suzhou’s semiconductor belt and Shenzhen’s Mini LED ecosystem. It is ideal for high-reliability glass components in 5G communication, data centers, and advanced optoelectronic devices.
Core Advantages:
Non-contact processing avoids material damage
Sub-micron precision meets semiconductor-grade requirements
Reduces production cycles by 60% vs. traditional me
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